電子零件膠帶

Description :

Electronic components that support the latest devices... and the Nitto Denko adhesive technology that supports these components For the electronic components needed in the latest electronic devices, the adhesive technologies developed by Nitto Denko over many years include a thermal release tape for precision cutting processes, and porous sheet made of ultrahigh- molecular-weight polyethylene, SUN MAP. In addition, Nitto Denko's paper carrier tapes (for both axial and radial components) are used for conveying electronic components and for automatic mounting. For high-precision condensers, various cutting-edge adhesive technologies, such as Nitto Denko's adhesive tape for condensers, are employed. Inside such products, and during the manufacturing process, fluoroplastic NITOFLON Tapes No.900UL & No. 903UL, and Nitto's surface protection material are used. Nitto Denko's adhesive tape technology contributes to all of these.